SemiAnalysis Bridging the gap between the world's most important industry, semiconductors, and business.
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ISSCC 2026: NVIDIA & Broadcom CPO, HBM4 & LPDDR6, TSMC Active LSI, Logic-Based SRAM, UCIe-S and More
by Afzal Ahmad on April 15, 2026
ISSCC 2026 Round-Up
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The Great GPU Shortage – Rental Capacity – Launching our H100 1 Year Rental Price Index
by Daniel Nishball on April 2, 2026
GPU Rental Pricing Dashboard Launch
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Dissecting Nvidia Blackwell - Tensor Cores, PTX Instructions, SASS, Floorsweep, Yield
by Kimbo Chen on March 31, 2026
Microbenchmarking, tcgen05, 2SM MMA, UMMA, TMA, LDGSTS, UBLKCP, Speed of Light, Distributed Shared Memory, GPC Floorsweeps, SM Yield
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Nvidia – The Inference Kingdom Expands
by Dylan Patel on March 24, 2026
Groq LP30, LPX Rack, Attention FFN Disaggregation, Oberon & Kyber Updates, Nvidia's CPO Roadmap, Vera ETL256, CMX & STX
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The Great AI Silicon Shortage
by Ivan Chiam on March 12, 2026
TSMC N3 Wafer Shortages, Memory Constraints, Datacenter Bottlenecks, Supply Chain Wars Winner
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Are AI Datacenters Increasing Electric Bills for American Households?
by Aishwarya Mahesh on March 3, 2026
Power prices misconception, PJM's poor market design, Capacity prices 9.3x growth,
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Vera Rubin – Extreme Co-Design: An Evolution from Grace Blackwell Oberon
by Wega Chu on February 25, 2026
Vera, Rubin, NVLink 6 Switch, ConnectX-9, BlueField-4, Spectrum-6, Seamless Cableless Compute Tray Design, Power Rack, VR NVL72 TCO and BoM
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InferenceX v2: NVIDIA Blackwell Vs AMD vs Hopper - Formerly InferenceMAX
by Dylan Patel on February 16, 2026
The Artist Known as InferenceMAX. GB300 NVL72, MI355X, B200, H100, Disaggregated Serving, Wide Expert Parallelism, Large Mixture of Experts, SGLang, vLLM, TRTLLM
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CPUs are Back: The Datacenter CPU Landscape in 2026
by Gerald Wong on February 9, 2026
RL and Agent Usage, Context Memory Storage, DRAM Pricing Impacts, CPU Interconnect Evolution, AMD Venice, Verano, Florence, Intel Diamond Rapids, Coral Rapids, Arm Phoenix + Venom, Graviton 5, Axion
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Memory Mania: How a Once-in-Four-Decades Shortage Is Fueling a Memory Boom
by Dylan Patel on February 6, 2026
Pricing doubles again, Supercycle is bigger, and could last longer than you think
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Claude Code is the Inflection Point
by Doug O'Laughlin on February 5, 2026
What It Is, How We Use It, Industry Repercussions, Microsoft's Dilemma, Why Anthropic Is Winning
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From Tokens to Burgers: A Water Footprint Face-Off
by Nicolas Bontigui on January 15, 2026
A different perspective on the datacenter water debate, forget tokens/watt or tokens/dollar, it's about tokens/burger, how many In-N-Outs is equivalent to the world's largest datacenter
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Interconnects Beyond Copper, 1,000 CFETs, SK Hynix Next-Gen NAND, 2D Materials, and More
by Gerald Wong on January 13, 2026
IEDM 2025 Round-Up
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Apple-TSMC: The Partnership That Built Modern Semiconductors
by Sravan Kundojjala on January 8, 2026
Wafer demand model, node economics, and the shifting power dynamics as AI reshapes the foundry landscape
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RL Environments and RL for Science: Data Foundries and Multi-Agent Architectures
by AJ Kourabi on January 6, 2026
Worker Automation, RL as a Service, Anthropic's next big bet, GDPval and Utility Evals, Computer Use Agents, LLMs in Biology, Mid-Training, Lab Procurement Patterns, Platform Politics and Access
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Co-Packaged Optics (CPO) Book – Scaling with Light for the Next Wave of Interconnect
by Dylan Patel on January 1, 2026
Co-Packaged Optics (CPO) has long promised to transform datacenter connectivity, but it has taken a long time for the technology to come to market, with tangible deployment-ready products only arriving in 2025.
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How AI Labs Are Solving the Power Crisis: The Onsite Gas Deep Dive
by Ajey Pandey on December 30, 2025
Bring Your Own Generation, Sayonara Electric Grid, Turbines vs. Recips. vs. Fuel Cells, Why Not Build More CCGTs?, Onsite Power TCO
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AWS Trainium3 Deep Dive | A Potential Challenger Approaching
by Dylan Patel on December 4, 2025
NL72x2/NL32x2 Scale Up Rack Architecture, Step-Function Software & System Improvements, Optimized Perf per TCO, “Amazon Basics” GB200 NVL36x2, Astera Labs, Trainium4
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TSMC Overseas Fabs – A Success?
by Dylan Patel on December 1, 2025
Why Morris Chang Said U.S. Fabs Will Fail, Wafer Cost and Economics of Taiwan vs. U.S. Fabs, TSMC Supply Chain Details
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TPUv7: Google Takes a Swing at the King
by Dylan Patel on November 28, 2025
Anthropic’s 1GW+ TPUs, New customers Meta/SSI/xAI/OAI, Full Stack Review of v7 Ironwood, CUDA Moat at risk, Next Generation TPUv8AX and TPUv8X versus Vera Rubin






